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IPSES_XJTAG_CaseStudy.pdf

xJTAG boundary scan fast-tracks solution for testing complex, high-density boards


Case study about the application developed by IPSES for Linkra, selecting XJTAG boundary scan to test complex boards containing over 20,000 solder joints with around 5500 connection nets. xJTAG boundary scan is able to test a high proportion of connections and components, including non-JTAG devices, with very few physical connections to the board: IPSES delivered a priced solution within a fast turnaround time using the xJTAG boundary scan system.

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