Following intel's thermal guide to measure
the temperature on CPU surface, we usually
drill a small hole right at the center of
the heat-sink, and
then insert a 36AWG
thermocouple through this hole. There is
about 2~3mm of the thermocouple junction
porption resides in the heat-sink's base
plate, where,you know is a high temperature
grident region, and the thermocouple surface
is surrounded by a boundary condition of
high temperature
grident. Dear Sir, do you
think this will lead to serious measurement
errors, except conduction ? Many Thanks !!