SVTRONICS has the latest revision of these open source interface PCBs in stock and available for ordering worldwide. Please contact Chris Dickey at SVTRONICS (firstname.lastname@example.org, Tel: 214.440.1234 x102) and reference the "SEMIKRON SKiiP3 Dual 26-Pin Interface PCB for NI GPIC."
Note that the interface design is open source and is intended to be a starting point for full scale power converter interface board designs. For example, if your application utilizes SEMIKRON SEMIKUBE power converters, you would modify the 26-pin SKiiP3 ribbon cable connectors to match the 34-pin SEMIKUBE pinout. The board also includes screw terminal connectivity for the GPIC I/O, which is ideal for rapid prototyping. For production, the screw terminal connectors are typically replaced with mass termination connectors (i.e. ribbon cable or DSUB connectors) and the mechanical design of the board is adjusted to meet the exact application specific requirements for the converter cabinet.
Below are details on the latest revision of the open source template design.
Update September 4, 2014:
Read a whitepaper about this design:
Latest Version: Revision 2, Version v03
Revision 2, Version v03 Notes:
System Grounding Recommendations:
NOTE 1: Do not connect ±15 sensor GND/COM to any other system ground other than CS_COM.
NOTE 2: Do not use the 15V sensor power supply as the gate driver control signal power supply.
Your custom mating board maps the GPIC I/O to your connectors of choice and typically includes things like the following:
When using a user defined mating board to connect to the GPIC board:
The Simultaneous Analog Input section of the NI sbRIO GPIC is functionally (not safety) isolated from the other sections of the board, and the differential channels are pseudo-differential. The design was done this way to match the pseudo-differential outputs of the Semikron module, and is generally the lower cost approach to such a circuit. However, because the channels are pseudo-differential, maintaining good common mode rejection requires careful attention to grounding. The Semikron module has a chassis terminal that is shown connected to their board's ground in the SKiiP 4 application note; however, this will defeat the common mode rejection. See the grounding scheme diagram below for more details.
System Diagram (Semikron SKiiP and LEM Sensor Example):
Ultiboard PCB layout:
TOP (IDC headers for NI sbRIO GPIC, screw terminals for I/O signals and power, shunt resistor pads):
BOTTOM (Dual 26-pin connectors for SKiiP 3 and Smart PowerStack):
Multisim circuit schematic:
Is it possible to acquire one of these sample mating boards as I do no have the capacity to manufacture one myself but could really use one for a prototype project I'm starting with the 9606/9683 combination boards?
You bet. Just open the design in NI Ultiboard, export the Gerber files, and send them along with the bill of materials to a PCB/assembly house.
If you or a technician plan to solder the components on yourself, Sunstone Circuits is a good choice. The last order we placed with them was for the latest version (revision 2, version v03) using order number "FP0326871". If you reference that order number, you could call them and reorder it. Then you would purchase the screw terminal connectors and resistors from Mouser or Digikey. The IDC mating connectors for the GPIC are ordered from On-Shore (email@example.com). (See the bill of materials.)
Alternately, if you want to buy a full assembled board with all the parts soldered on, either Screaming Circuits or SVTRONICS are good choices. If you are located internationally, you may wish to order from a local PCB or turnkey assembly house.
March 5, 2014: We are in the process of updating the GPIC Interface Board template design. In the mean time, if you are starting a new design or planning to order a board, please contact Brian MacCleery for details (firstname.lastname@example.org).
Was the update published somewhere else or is it yet to be published?
We received PCBs two weeks ago and are currently testing the latest version. We expect to finish testing and post the updated design files within 1-2 weeks. Meanwhile, if you would like the latest design files, just email me (email@example.com).
By the way, always be sure to request >= 93 mil PCB thickness for all GPIC mating boards for mechanical strength reasons.
When we post the updated design files we will also send them to SVTronics so you can order the boards from them. When ordering GPIC interface boards from SVTronics, always communicate with Angela Dodd.
Tel: 214.440.1234 x110
Plano, TX. 75074
With a correctly designed GPIC interface PCB and proper cabinet cable routing and shielding, examples of the EMC and surge compliance tests commonly passed by sbRIO GPIC converter cabinets are listed below. These compliance tests commonly include ESD, EFT, surge, radiated, ring wave, conducted immunity, etc.
Thank you to our customer for allowing me to share these details from their test report. Below are examples of CE Compliance EMC, transient, surge tests passed by the NI sbRIO-9606 Rev. E and NI 9683 GPIC in a 100 kVA 3-phase AC (422-528 VAC, 136 A) and 550-770 VDC, 200 A DC energy storage converter cabinet:
The system passed all the tests.
The system was measured for pre-compliance with European Standards EN 61000-6-4, "Electromagnetic Compatibility (EMC) – Part 6-4: Generic Standards – Emission Standard for Industrial Environments (2007)," and IEC TS 61000-6-5, "Electromagnetic Compatibility (EMC) – Part 6-5: Generic Standards – Immunity for Power Station and Substation Environments (2001)."
Radiated emission measurement equipment and procedures were in accordance with EN 55011, "Industrial, Scientific and Medical Radio Frequency Equipment – Electromagnetic Disturbance Characteristics – Limits and Methods of Measurement (2010)." The emissions tests described in this report are used for verification with the Code of Federal Regulations Chapter 47, "Part 15 – Radio Frequency Devices, Subpart B: Unintentional Radiators," paragraph 15.107, Conducted Emission Limits and paragraph 15.109, Radiated Emission Limits. Additionally, the tests are used to show compliance with ICES-003, Issue 5 "Information Technology Equipment (ITE) – Limits and Methods of Measurement (2012)."
Immunity measurement equipment and procedures were in accordance with:
• EN 61000-4-2, "Electromagnetic Compatibility (EMC) Part 4-2: Testing and Measurement Techniques – Electrostatic Discharge Immunity Test (2009),"
• EN 61000-4-3, "EMC Part 4-3: Testing and Measurement Techniques – Radiated, Radio-Frequency, Electromagnetic Field Immunity Test (2010),"
• EN 61000-4-4, "EMC Part 4-4: Testing and Measurement Techniques – Electrical Fast Transient/Burst Immunity Test (2012),"
• EN 61000-4-5, "EMC Part 4-5: Testing and Measurement Techniques – Surge Immunity Test (2006),"
• EN 61000-4-6, "EMC Part 4-6: Testing and Measurement Techniques – Immunity to Conducted Disturbances, Induced by Radio-Frequency Fields (2009),"
• IEC 61000-4-12, "EMC Part 4-12: Testing and Measurement Techniques – Ring Wave Immunity Test (2006)."
Per the EMC test plan: For emissions, the system is Class A, Group 1 equipment. Immunity requirements and performance criteria are from EN 61000-6-5, Table 1, "Immunity Specifications – Enclosure Ports," Table 3, "Immunity Specifications – Low-voltage AC Input Power Ports and Low voltage AC Output Power Ports," and Table 4, "Immunity Specifications – Low-voltage DC Input Power Ports and Low-voltage DC Output Power Ports." There are DC input lines and AC output/control/transformer lines. There are not any possible magnetically sensitive components.
The system is compliant with the EN 61000-6-4 radiated and conducted emissions limits. The system complies when subjected to EN 61000-6-5 levels for ESD, EFT, surge, radiated, ring wave, and conducted immunity.
Section X compares the unit radiated emissions to the applicable limit from 30 MHz to 1000 MHz in accordance with equations identified in VI and the output identified in measurement procedure VIII-1. Section XI compares the unit conducted emissions to the applicable limits from 150 kHz to 30 MHz in accordance with measurement procedure VIII-2. Sections XII through XVII reference measurement procedures of VIII-3 through -8 in accordance with susceptibility and performance criteria described in Section V for type acceptance and per the manufacturer's test plan.
1. 4-kV electrical fast transients, delivered in 5-kHz bursts to the DC power lines
2. 2-kV electrical fast transients, delivered in 5-kHz bursts to the AC lines
3. 2-kV line-to-line/4-kV line-to-ground, 1.2/50microsecond combination wave surges, delivered directly or by phase synchronization to the DC input
4. 2-kV line-to-line/4-kV line-to-ground, 1.2/50microsecond combination wave surges, delivered directly or by phase synchronization to the AC lines
5. 1-kV line-to-line/2.5-kV line-to-ground, 1 MHz ring wave wave surges, delivered directly or by phase synchronization to the DC input
6. 0.5-kV line-to-line/1-kV line-to-ground, 1.2/50microsecond combination wave surges, delivered directly or by phase synchronization to the AC lines
Do you have the information about GPIC Interface Board (mating board) Maximum load? What is the maximum rating of load that can be driven from this board (single phase as well as three phase)?