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[TLF 2016 Presentation] - Changing Packaging Trends and the Impact on Test - E. Jan Vardaman, TechSearch International

Packaging Trends and the Impact on Test

Smart devices are expected to collect and then transmit and/or process information, which provides explosive growth in the connectivity commonly referred to as the Internet of Things (IoT) or the Internet of Everything. This translates into an increasing number of MEMSs and sensors plus the systems to collect, store, monitor, and analyze the data generated. The era of smartphones drove the development of thin, low-profile packages. Mobile devices such as smartphones remain the major driver for both the package development and unit volume growth in the semiconductor industry. What type of packages will this new era of connectivity generate and how will it change test requirements? This presentation examines the role of increasingly popular packages, including system in package (SiP) and fan-out wafer-level package (FO-WLP), and provides insight into the future test requirements.

E. Jan Vardaman, President and Founder, Techsearch International Inc.

Ben R.
Aerospace & Defense Test
Solutions Marketer
National Instruments
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